Hsiang-Hung Chang: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

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[IEEE 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] 2015 International Symposium on VLSI Technology, Systems and Applications - Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor

Chang, Hsiang-Hung, Hsiao, Zhi-Cheng, Wang, Jen-Chun, Chien, Chun-Hsien, Ko, Cheng-Ta, Zhan, Chau-Jie, Huang, Yu-Wei, Hsin, Yu-Chen, Wang, Chung-Chih, Tzeng, Pei-Jer, Lin, Cha-Hsin, Lee, Chia-Hsin, Ch

Рік:

2015

Мова:

english

Файл:

PDF, 941 KB

english, 2015

Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology

Shen, Wen-Wei, Lin, Yu-Min, Wu, Sheng-Tsai, Lee, Chia-Hsin, Huang, Shin-Yi, Chang, Hsiang-Hung, Chang, Tao-Chih, Chen, Kuan-Neng

Журнал:

Journal of Nanoscience and Nanotechnology

Рік:

2018

Мова:

english

Файл:

PDF, 15.29 MB

english, 2018

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology

Hsiao, Zhi-Cheng, Ko, Cheng-Ta, Chang, Hsiang-Hung, Fu, Huan-Chun, Chiang, Chia-Wei, Hsu, Chao-Kai, Shen, Wen-Wei, Lo, Wei-Chung

Рік:

2015

Мова:

english

Файл:

PDF, 1.00 MB

english, 2015

Investigation of Stress Effect of Electromigration Behavior of Aluminum Strip

Chien-Chen Lee, Hsiang-Hung Chang, Chien-Chia Chiu, Kuo-Ning Chiang

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2011

Мова:

english

Файл:

PDF, 1.06 MB

english, 2011

High glucose concentration up-regulates the expression of matrix metalloproteinase-9 and -13 in tendon cells

Tsai, Wen-Chung, Liang, Fang-Chen, Cheng, Ju-Wen, Lin, Li-Ping, Chang, Shih-Chieh, Chen, Hsiang-Hung, Pang, Jong-Hwei S

Журнал:

BMC Musculoskeletal Disorders

Рік:

2013

Мова:

english

Файл:

PDF, 262 KB

english, 2013

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Process integration of 3D Si interposer with double-sided active chip attachments

Tzeng, Pei-Jer, Lau, John H., Zhan, Chau-Jie, Hsin, Yu-Chen, Chang, Po-chih, Chang, Yiu-Hsiang, Chen, Jui-Chin, Chen, Shang-Chun, Wu, Chien-Ying, Lee, Ching-Kuan, Chang, Hsiang-Hung, Chien, Chun-Hsien

Рік:

2013

Мова:

english

Файл:

PDF, 1.88 MB

english, 2013

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Process integration of 3D stacking for backside illuminated image sensor

Hsiao, Zhi-Cheng, Ko, Cheng-Ta, Chang, Hsiang-Hung, Fu, Huan-Chun, Chao-Kai Hsu,, Shu-Man Li,, Tsai, Wen-Li, Wen-Wei Shen,, Jen-Chun Wang,, Yu-Min Lin,, Wei-Chung Lo,

Рік:

2014

Мова:

english

Файл:

PDF, 1.48 MB

english, 2014

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Process, assembly and electromigration characteristics of glass interposer for 3D integration

Chien, Chun-Hsien, Lee, Ching-Kuan, Lin, Chun-Te, Lin, Yu-Min, Zhan, Chau-Jie, Chang, Hsiang-Hung, Hsu, Chao-Kai, Fu, Huan-Chun, Shen, Wen-Wei, Huang, Yu-Wei, Ko, Cheng-Ta, Lo, Wei-Chung, Lu, Yung Jea

Рік:

2014

Мова:

english

Файл:

PDF, 2.51 MB

english, 2014

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Characterization of organic multi-mode optical waveguides for the electro-optical printed circuit board (EOPCB)

Li-Cheng Shen,, Wei-Chung Lo,, Hsiang-Hung Chang,, Huan-Chun Fu,, Yuan-Chang Lee,, Yu-Chih Chen,, Shu-Ming Chang,, Wun-Yan Chen,, Ming-Chieh Chou,

Рік:

2004

Мова:

english

Файл:

PDF, 411 KB

english, 2004

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

Shen, Wen-Wei, Chang, Hsiang-Hung, Wang, Jen-Chun, Ko, Cheng-Ta, Tsai, Leon, Wang, Bor Kai, Shorey, Aric, Lee, Alvin, Su, Jay, Bai, Dongshun, Huang, Baron, Lo, Wei-Chung, Chen, Kuan-Neng

Рік:

2015

Мова:

english

Файл:

PDF, 982 KB

english, 2015

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Performance and process characteristic of glass interposer with through-glass-via(TGV)

Chien, Chun-Hsien, Yu, Hsun, Lee, Ching-Kuan, Lin, Yu-Min, Cheng, Ren-Shin, Zhan, Chau-Jie, Chen, Peng-Shu, Liu, Chang-Chih, Hsu, Chao-Kai, Chang, Hsiang-Hung, Fu, Huan-Chun, Lee, Yuan-Chang, Shen, We

Рік:

2013

Мова:

english

Файл:

PDF, 1.22 MB

english, 2013

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

Lin, Yu-Min, Wu, Sheng-Tsai, Shen, Wen-Wei, Huang, Shin-Yi, Kuo, Tzu-Ying, Lin, Ang-Ying, Chang, Tao-Chih, Chang, Hsiang-Hung, Lee, Shu-Man, Lee, Chia-Hsin, Su, Jay, Liu, Xiao, Wu, Qi, Chen, Kuan-Neng

Рік:

2018

Мова:

english

Файл:

PDF, 696 KB

english, 2018

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Nanotwinned Copper Hybrid Bonding and Wafer-On-Wafer Integration

Chiu, Wei-Lan, Chou, Kai-Wei, Chang, Hsiang-Hung

Рік:

2020

Файл:

PDF, 1.20 MB

2020

Prevalence and Risk Factors for Feeding and Swallowing Difficulties in Spinal Muscular Atrophy Types II and III

Yen-Shan Chen, Hsiang-Hung Shih, Tai-Heng Chen, Chang-Hung Kuo, Yuh-Jyh Jong

Журнал:

The Journal of Pediatrics

Рік:

2012

Мова:

english

Файл:

PDF, 333 KB

english, 2012

HLA typing associated with hepatitis B E antigen seroconversion in children with chronic hepatitis B virus infection: A long-term prospective sibling cohort study in Taiwan

Jia-Feng Wu, Chen-Hsin Chen, Rhong-Phong Hsieh, Hsiang-Hung Shih, Yi-Hau Chen, Chi-Rong Li, Chih-Yao Chiang, Wen-Yi Shau, Yen-Hsuan Ni, Huey-Ling Chen, Hong-Yuan Hsu, Mei-Hwei Chang

Журнал:

The Journal of Pediatrics

Рік:

2006

Мова:

english

Файл:

PDF, 222 KB

english, 2006

Endoscopic Treatment of Esophageal Foreign Bodies in the Elderly

Lin, Hsin-Chang, Chen, Chih-Jen, Lin, Hsiang-Hung, Huang, Jung-Tang, Chen, Ming-Jen

Журнал:

International Journal of Gerontology

Рік:

2013

Мова:

english

Файл:

PDF, 741 KB

english, 2013

Fecal Elastase 1, Serum Amylase and Lipase Levels in Children with Cholestasis

Wen, Wan-Hsin, Chen, Huey-Ling, Chang, Mei-Hwei, Ni, Yen-Hsuan, Shih, Hsiang-Hung, Lai, Hong-Shiee, Hsu, Wen-Ming

Журнал:

Pancreatology

Рік:

2005

Мова:

english

Файл:

PDF, 95 KB

english, 2005

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Flexible Electronic-Optical Local Bus Modules to the Board-to-Board, Board-to-Chip, and Chip-to-Chip Optical Interconnection

Li-Cheng Shen,, Wei-Chung Lo,, Hsiang-Hung Chang,, Huan-Chun Fu,, Yuan-Chang Lee,, Shu-Ming Chang,, Yu-Chih Chen,, Wun-Yan Chen,

Рік:

2005

Мова:

english

Файл:

PDF, 756 KB

english, 2005

[IEEE Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan (2007.01.16-2007.01.18)] Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Recent Trend of Optical Circuit Board in Taiwan

Lee, Shin-Ge, Lee, Chun-Hsing, Lu, Chien Chun, Cheng, Fu-Yi, Shen, Kun-Yi, Huang, Sheng-Ho, Shen, Li-Cheng, Chang, Shu-Ming, Chang, Hsiang-Hung, Fu, Huan-Chun, Tien, Pei, Chu, Mu-Tao, Chan, Yi-Jen

Рік:

2007

Мова:

english

Файл:

PDF, 2.40 MB

english, 2007

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Interconnection of Flexible Electronic-Optical Circuit Board Module

Chang, Hsiang-hung, Lo, Wei-chung, Shen, Li-cheng, Fu, Huan-chun, Lee, Yuan-chang, Chang, Shu-ming

Рік:

2006

Мова:

english

Файл:

PDF, 3.53 MB

english, 2006

[IEEE 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu, Taiwan (2007.04.23-2007.04.25)] 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - 3D Chip-to-Chip Stacking with Through Silicon Interconnects

Lo, Wei-Chung, Chang, Shu-Ming, Chen, Yu-Hua, Ko, Jeng-Dar, Kuo, Tzu-Ying, Chang, Hsiang-Hung, Shih, Ying-Ching

Рік:

2007

Мова:

english

Файл:

PDF, 2.43 MB

english, 2007

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - A low cost rigid-flex opto-electrical link for mobile devices

Huang, Sheng-Ho, Lee, Chun-Hsing, Hu, Hung-Lien, Chu, Mu-Tao, Yeh, Jen-Hao, Chen, Yuan-Chin, Huang, Yu-Ming, Hsu, Chao-Kai, Chang, Hsiang-Hung, Fu, Huan-Chun

Рік:

2010

Мова:

english

Файл:

PDF, 408 KB

english, 2010

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Polymeric waveguides on rigid and flexible PCB

Wei-Chung Lo,, Li-Cheng Shen,, Hsiang-Hung Chang,, Huan-Chun Fu,, Yu-Chih Chen,, Shu-Ming Chang,, Yuan-Chang Lee,, Wun-Yan Chen,, Ming-Chieh Chou,

Рік:

2004

Мова:

english

Файл:

PDF, 399 KB

english, 2004

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Laminating thin glass onto glass carrier to eliminate grinding and bonding process for glass interposer

Tsai, Leon, Wang, Bor Kai, Shorey, Aric, Lee, Alvin, Su, Jay, Huang, Baron, Shen, Wen-Wei, Chang, Hsiang-Hung, Chien, C. H.

Рік:

2014

Мова:

english

Файл:

PDF, 249 KB

english, 2014

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Flexible and ultra-thin embedded chip package

Tzu-Ying Kuo,, Ying-Ching Shih,, Yuan-Chang Lee,, Hsiang-Hung Chang,, Zhi-Cheng Hsiao,, Chia-Wen Chiang,, Shu-Man Li,, Yu-Jiau Hwang,, Cheng-Ta Ko,, Yu-Hua Chen,

Рік:

2009

Мова:

english

Файл:

PDF, 1.23 MB

english, 2009

Use of Lactobacillus casei rhamnosus to Prevent Cholangitis in Biliary Atresia After Kasai Operation

Lien, Tien-Hau, Bu, Ling-Nan, Wu, Jia-Feng, Chen, Huey-Ling, Chen, An-Chyi, Lai, Ming-Wei, Shih, Hsiang-Hung, Lee, I-Hsien, Hsu, Hong-Yuan, Ni, Yen-Hsuan, Chang, Mei-Hwei

Журнал:

Journal of Pediatric Gastroenterology & Nutrition

Рік:

2015

Мова:

english

Файл:

PDF, 199 KB

english, 2015

10.1097/00006454-200307000-00003

YANG, YAO-JONG, LIU, CHING-CHUAN, CHEN, TE-JEN, LEE, MENG-FENG, CHEN, SHENG-HSIEN, SHIH, HSIANG-HUNG, CHANG, MEI-HWEI

Журнал:

Pediatric Infectious Disease Journal

Рік:

2003

Мова:

english

Файл:

PDF, 197 KB

english, 2003

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - A low-temperature temporary lamination and laser debonding technology to enable cost-effective fabrication of a through-glass-via (TGV) interposer on a panel substrate

Lee, Alvin, Su, Jay, Huang, Baron, Bai, Dongshun, Shen, Wen-Wei, Chang, Hsiang-Hung, Chiang, Chia-Wei

Рік:

2015

Мова:

english

Файл:

PDF, 1.31 MB

english, 2015

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Reliability test for integrated Glass interposer

Ching-Kuan Lee,, Jen-Chun Wang,, Yu-Min Lin,, Chau-Jie Zhan,, Wen-Wei Shen,, Huan-Chun Fu,, Yuan-Chang Lee,, Chia-Wen Chiang,, Su-Ching Chung,, Su-Mei Chen,, Chia-Wen Fan,, Hsiang-Hung Chan

Рік:

2016

Мова:

english

Файл:

PDF, 2.20 MB

english, 2016

Role of hepatitis B immunoglobulin in infants born to hepatitis B e antigen-negative carrier mothers in Taiwan

YANG, YAO-JONG, LIU, CHING-CHUAN, CHEN, TE-JEN, LEE, MENG-FENG, CHEN, SHENG-HSIEN, SHIH, HSIANG-HUNG, CHANG, MEI-HWEI

Журнал:

Pediatric Infectious Disease Journal

Рік:

2003

Мова:

english

Файл:

PDF, 197 KB

english, 2003

Laparoscopy in Children With Acute Intestinal Obstruction by Aberrant Congenital Bands

Chang, Yu-Tang, Chen, Bai-Hsiun, Shih, Hsiang-Hung, Hsin, Yu-Mei, Chiou, Chi-Shu

Журнал:

Surgical Laparoscopy Endoscopy & Percutaneous Techniques

Рік:

2010

Мова:

english

Файл:

PDF, 191 KB

english, 2010

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reliability evaluation of glass interposer module

Lee, Ching-Kuan, Wang, Jen-Chun, Zhan, Chau-Jie, Shen, Wen-Wei, Fu, Huan-Chun, Lee, Yuan-Chang, Fan, Chia-Wen, Chen, K. C., Chang, Hsiang-Hung, Lu, Yung Jean Rachel

Рік:

2016

Мова:

english

Файл:

PDF, 1.15 MB

english, 2016

Hiatal Hernia: A Rare Cause of Iron-Deficiency Anemia in Children

Shih, Tai-Chuan, Shih, Hsiang-Hung, Chang, Yu-Tang, Dai, Zen-Kong, Chen, I-Chen

Журнал:

Pediatrics & Neonatology

Рік:

2016

Мова:

english

Файл:

PDF, 280 KB

english, 2016

The Application of EUS-guided FNA in the Diagnosis of Pancreatic Neoplasms in the Elderly

Lin, Hsiang-Hung, Chang, Chen-Wang, Wu, Pao-Shu, Chu, Cheng-Hsin, Shih, Shou-Chuan, Chen, Ming-Jen

Журнал:

International Journal of Gerontology

Рік:

2017

Мова:

english

Файл:

PDF, 556 KB

english, 2017

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP

Shen, Wen-Wei, Lin, Yu-Min, Chang, Hsiang-Hung, Kuo, Tzu-Ying, Fu, Huan-Chun, Lee, Yuan-Chang, Lee, Shu-Man, Lin, Ang-Ying, Huang, Shin-Yi, Chang, Tao-Chih, Lee, Alvin, Su, Jay, Huang, Baron, Bai, Don

Рік:

2017

Мова:

english

Файл:

PDF, 1.11 MB

english, 2017

3D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

Shen, Wen-Wei, Lin, Yu-Min, Chen, Shang-Chun, Chang, Hsiang-Hung, Chang, Tao-Chih, Lo, Wei-Chung, Lin, Chien-Chung, Chou, Yung-Fa, Kwai, Ding-Ming, Kao, Ming-Jer, Chen, Kuan-Neng

Журнал:

IEEE Journal of the Electron Devices Society

Рік:

2018

Мова:

english

Файл:

PDF, 6.27 MB

english, 2018

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Antenna on glass for 60GHz WiGig application

Lee, Ching Kuan, Lu, Yung Jean Rachel, Chang, Hsiang-Hung, Chang, Li-Chi, Chen, Chang-Sheng

Рік:

2018

Мова:

english

Файл:

PDF, 2.80 MB

english, 2018

TRIM5α Promotes Ubiquitination of Rta from Epstein–Barr Virus to Attenuate Lytic Progression

Huang, Hsiang-Hung, Chen, Chien-Sin, Wang, Wen-Hung, Hsu, Shih-Wei, Tsai, Hsiao-Han, Liu, Shih-Tung, Chang, Li-Kwan

Журнал:

Frontiers in Microbiology

Рік:

2017

Мова:

english

Файл:

PDF, 2.64 MB

english, 2017

Gastric MALT lymphoma presented with primary perforation in an adolescent: a case report

Chang, Yu-Tang, Huang, Ming-Yii, Shih, Hsiang-Hung, Wu, Chun-Chieh, Lu, Tzu-Ying, Lin, Pei-Chin

Журнал:

BMC Pediatrics

Рік:

2019

Мова:

english

Файл:

PDF, 2.06 MB

english, 2019

Expression of Rta in B Lymphocytes during EpsteinâBarr Virus Latency

Hwang, Sseu-Pei, Huang, Lin-Chen, Wang, Wen-Hung, Lin, Min-Hsuan, Kuo, Chung-Wen, Huang, Hsiang-Hung, Chang, Li-Kwan

Журнал:

Journal of Molecular Biology

Рік:

2020

Файл:

PDF, 13.88 MB

2020